GA-5507 Ball Bonding Small Testing Machine
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描述
Ball Bonding Testing Machine
Product use
The machine is used to test the bonding fastness of badminton chip and ball head. The fixed load is applied to the bonding place of badminton chip and ball head to test whether it is decomposed.
| weights | 180氮 |
| 总体维度 | 40*25*58厘米 |
| How the weights are lifted | Activated type |
| 重量 | About 20kg |
| 能量源 | 交流220V,5A |
Ball Bonding Testing Machine
