GA-5507 Ball Bonding Small Testing Machine
- Penerangan
- Siasatan
Penerangan
Ball Bonding Testing Machine
Product use
The machine is used to test the bonding fastness of badminton chip and ball head. The fixed load is applied to the bonding place of badminton chip and ball head to test whether it is decomposed.
| weights | 180N |
| Overall dimension | 40*25*58cm |
| How the weights are lifted | Activated type |
| berat badan | About 20kg |
| Sumber kuasa | AC220V,5A |
Ball Bonding Testing Machine
