GA-5507 Ball Bonding Small Testing Machine
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Descripción
Ball Bonding Testing Machine
Uso del producto
The machine is used to test the bonding fastness of badminton chip and ball head. The fixed load is applied to the bonding place of badminton chip and ball head to test whether it is decomposed.
| pesas | 180norte |
| Dimensión global | 40*25*58cm |
| How the weights are lifted | Activated type |
| peso | Alrededor de 20 kg |
| Fuente de alimentación | CA 220 V.,5A |
Ball Bonding Testing Machine
